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New sensing method measures laser-cutting depth by tracking vaporization recoil

Laser dicing, a technique that uses focused laser pulses to separate individual chips from a semiconductor wafer, is increasingly favored over mechanical blade cutting because it can process delicate, low-strength materials with minimal physical stress. However, achieving proper

Phys.org1 phút đọc

New sensing method measures laser-cutting depth by tracking vaporization recoil

Laser dicing, a technique that uses focused laser pulses to separate individual chips from a semiconductor wafer, is increasingly favored over mechanical blade cutting because it can process delicate, low-strength materials with minimal physical stress. However, achieving proper

Nguồn: Phys.org

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